PCIe Chapter 20: Transmitter Electrical Requirements

Tx (Transmitter) limits depend on the measurement reference point, clock architecture, rate, and test pattern. Begin with the path in Figure 8-1, then connect voltage, equalization, and jitter to the applicable conditions.

Tx measurement path and reference conditionsChoose the transmitter measurement point and its applicable test conditions.Tx under testBreakout channelMeasurement equipmentReference clock conditionsSelect processing / reference planeCheck parameter, units, and notesSignalWaveformArchitecturePost-process
Author-drawn measurement overview. Select processing for the actual parameter and retain its method and exceptions.

Connect the accessible point to the specified reference plane

In Figure 8-1 locate the DUT (Device Under Test) Tx pins, the Breakout Channel leading to connectors, and accessible point TP1. A waveform captured at TP1 includes that channel's effects.

Next locate the Replica Channel and its TP2/TP3 ends. It reproduces the breakout path's electrical characteristics to help refer measurements to the pins; it is not another series path traversed by Tx data. Section 8.3.1.1 de-embeds voltage parameters to pins unless stated otherwise.

De-embedding removes measurement-path effects using channel characteristics. It is not subtraction of a fixed voltage or jitter value. Section 8.3.5.2 also explains high-frequency noise amplification and the applicable processing limits.

Record the DUT/Lane, rate, full/reduced swing, pattern, clock architecture, measurement point, and processing before comparing a report with a parameter limit.

Base 6.0 §8.3.1 Measurement Setup for Characterizing Transmitters, Figure 8-1 Tx Test Board for Non-Embedded Refclk (p.1318); §8.3.1.1 Breakout and Replica Channels (pp.1319–1320); §§8.3.5.1–8.3.5.2 (pp.1336–1337).

Choose sampling and processing from the clock architecture

Refclk (Reference Clock) location, availability at DUT pins, and SRIS testing (separate reference clocks with independent spread spectrum) affect the method. In Table 8-5 select the column and row before reading their intersection.

Selected conditionsTable 8-5 positionSampling and processing
Non-Embedded Refclk; available at DUT pins; not testing SRISRight column, first row1-port measurement, CC CDR, clean external Refclk
Embedded Refclk; available at DUT pins; not testing SRISLeft column, first row2-port measurement, CC CDR, PLL (note 1), and 10 ns transport delay

CDR (Clock and Data Recovery) here is the processing model; CC means Common Clock. The second row captures Tx data and Tx Refclk simultaneously to remove shared clock jitter. This choice is separate from D+ and D− being two conductors. Obtain PLL (Phase-Locked Loop) characteristics from the rate-specific Refclk section and transport delay from §8.6.6; do not silently set the latter to zero.

For Independent Refclk (IR), §8.3.5.3 requires single-port jitter measurement with the appropriate model CDR. The table above reads only two selected combinations; use the full table for others. A DUT supporting several Refclk modes needs testing in each supported mode.

Base 6.0 Figure 8-2 Tx Test board for Embedded Refclk (p.1319); §§8.3.5.3 Independent Refclk Measurement and Post Processing and 8.3.5.4 Embedded and Non-Embedded Refclk Measurement and Post Processing, Table 8-5 Tx Measurement and Post Processing For Different Refclks (p.1338).

Identify the voltage quantity before looking up its limit

Read §8.3.2, then Figure 8-3. D+ and D− are individual single-ended voltages. Subtract them for differential voltage and average them for common mode.

VDIFF = VD+ − VD−; VCM = (VD+ + VD−) / 2. Peak-to-peak voltage, written mVPP here, is the maximum minus minimum of the same quantity. Equation 8-1's VDIFFp-p = 2 × max|VD+ − VD−| specifically assumes a symmetric differential swing.

Figure 8-3 relates these waveforms; it does not let an arbitrary curve height stand in for a specified Tx measurement. Follow the applicable §8.3.3.6 or §8.3.3.7 method, then select the rate, parameter, and units in Table 8-6.

Base 6.0 §8.3.2 Voltage Level Definitions, Equations 8-1 VDIFFp-p and 8-2 VTX-AC-CM-PP (p.1320); Figure 8-3 Single-ended and Differential Levels (p.1321).

Why does 450 mVPP single-ended become 900 mVPP differential?

Simulated data: Author-created teaching data, not a device/platform measurement. Assume one Endpoint Tx Lane driving from the DUT toward TP1 at 5.0 GT/s, full swing, Non-Embedded Refclk, clean external clock, and no SRIS test. The chosen method is 1-port measurement with CC CDR. Assume the applicable compliance test load and the channel processing required for differential voltage.

Section 8.3.3.6 uses average transition eye amplitude at 0.5 UI over 500 Compliance Pattern repetitions at 2.5/5.0 GT/s. The following are idealized representative levels under that assumption; they explain amplitudes without modeling edges, overshoot, or noise. UI (Unit Interval) supplies the time unit for that sampling location.

Complementary representative stateD+ (mV)D− (mV)VDIFF (mV)VCM (mV)
H825375+450600
L375825−450600

State H gives 825 − 375 = +450 mV; state L gives 375 − 825 = −450 mV. Differential peak-to-peak is therefore +450 − (−450) = 900 mVPP. Each individual conductor varies from 375 to 825 mV, only 450 mVPP single-ended. Both states give 600 mV common mode, an average potential rather than differential swing.

Single-ended and differential voltage in the author caseComplementary 825/375 mV single-ended levels produce +450/-450 mV differential levels, a 900 mV differential peak-to-peak swing, and 600 mV common mode.Single-ended: D+ solid / D− dashed825 mV375 mV450mVPPDifferential: D+ − D−+450 mV0 mV−450 mV900mVPPVCM = (D+ + D−) / 2 = 600 mV
Author-drawn idealized waveforms with no time scale, transition duration, or noise. The two plots use their labeled voltage scales. Common-mode 600 mV is not the differential zero.

Follow Note 3 back to the method

In Table 8-6 choose VTX-DIFF-PP and the 5.0 GT/s column. Full-swing differential peak-to-peak voltage is 800–1000 mVPP. Note 3 points to §§8.3.3.6 / 8.3.3.7. Compare 900 mVPP from this case, rather than the 450 mVPP of D+ alone.

Under the stated measurement assumptions, that one swing result is in range. Jitter, common-mode noise, equalization, and other requirements need their own measurements. Two representative levels yielding 600 mV do not prove that a complete waveform has no AC common-mode noise.

Reduced-swing operation selects the separate VTX-DIFF-PP-LOW row. Both rows have a 1000 mVPP maximum in this edition, but different minima. A copied upper limit loses that mode distinction.

Base 6.0 §8.3.3.6 Method for Measuring VTX-DIFF-PP at 2.5 GT/s and 5.0 GT/s (p.1326); Table 8-6 Data Rate Dependent Transmitter Parameters, differential-swing rows (p.1348), Note 3 (p.1351).

Change methods when the rate and preset change

At 2.5/5.0 GT/s Tx equalization is de-emphasis, measured using the specified transition/non-transition average eye-amplitude ratio in §§8.3.3.1 / 8.3.3.4. Higher rates use coefficients and presets (predefined equalization combinations). Two representative levels from the preceding case are not a complete preset test.

For swing at 8.0/16.0/32.0/64.0 GT/s, §8.3.3.7 sets the applicable precursor/postcursor coefficients to zero and uses a low-frequency Compliance Pattern segment: 64 zeros then 64 ones at 8.0/16.0/32.0 GT/s, or 64 PAM4 level-0 then 64 level-3 symbols at 64.0 GT/s. Measure the specified late portion of each half-cycle and average 500 repetitions.

PAM4
Pulse Amplitude Modulation with 4 levels

For the preset itself, Figure 8-7 compares measured equalized output with a reconstruction made by applying coefficients to measured unequalized output, finding the best fit. Table 8-1 applies to 8.0/16.0/32.0 GT/s; Table 8-2 applies to 64.0 GT/s. Their ratios and tolerances define presets; coefficient magnitude is not output-voltage magnitude.

This connects to Chapter 19: the Link exchanges setting requests, while this chapter checks the resulting output. A requested setting, finished training, and a passed electrical requirement are separate observations.

Base 6.0 §§8.3.3.1–8.3.3.3 (pp.1321–1323); Tables 8-1 / 8-2 (pp.1324–1325); §§8.3.3.4–8.3.3.7 and Figure 8-7 Methodology for measuring Tx equalization coefficients and presets (pp.1325–1326).

Use the measured jitter quantity to select the pattern

Jitter (timing variation of edges or pulse widths) depends on pattern, equalization, and processing. Start with §8.3.5 before selecting a Table 8-6 parameter row.

Rate and measured quantityPattern in §8.3.5Tx equalization condition
2.5 / 5.0 GT/s jitterCompliance Pattern, with specified zero-crossing treatmentUse the applicable rate-specific de-emphasis setting
8.0 / 16.0 GT/s jitterCompliance Pattern, with specified zero-crossing treatmentThe preset yielding the lowest jitter should be selected
32.0 GT/s jitterJitter Measurement PatternMust use no Tx equalization
64.0 GT/s uncorrelated total jitter and deterministic jitterJitter Measurement Pattern, all twelve transitions between four PAM4 levelsMust use no Tx equalization
64.0 GT/s uncorrelated total pulse width jitter and deterministic pulse width jitterHigh Swing Toggle Pattern, transitions between levels 0 and 3Must use no Tx equalization
PAM4
Pulse Amplitude Modulation with 4 levels

Tx jitter measurements at 32.0 and 64.0 GT/s require at least 50 GHz oscilloscope bandwidth. At 64.0 GT/s the specified fourth-order Bessel-Thomson filter, down 3 dB at 33 GHz, is recommended. Preserve the difference between a requirement and a recommendation.

Section 8.3.5 requires other PCIe Lanes to transmit Compliance Pattern while measuring one Tx Lane, to capture die/package crosstalk. The DUT must also drive as many outputs as normal system operation would use. Follow these task-specific conditions rather than treating §8.3.1's general environment introduction as the complete procedure.

Finally check the reference plane for the actual item. Table 8-6 explicitly says that VTX-AC-CM-PP and VTX-AC-CM-PP-filtered noise analysis is done without de-embedding. These common-mode voltage parameters are not jitter, and are an exception to the general voltage-processing rule. A report saying “everything referred to pins” still needs a row-by-row applicability check.

Base 6.0 §8.3.5 Tx Jitter Parameters (p.1336), §§8.3.5.1–8.3.5.2 (pp.1336–1338); Table 8-6 common-mode rows and notes (p.1350). This is a reading guide, not the full compliance procedure.

Edition and sources

PCI Express Base Specification Revision 6.0 (6.0-1.0-PUB) is the authority. Printed and PDF-viewer page numbers match at these locations. Idealized levels and measurement assumptions are marked beside the case; they are not device measurements or certification.

Reading locations and purpose
  • §8.3.1, Figures 8-1 / 8-2 (pp.1318–1319); §8.3.1.1 (pp.1319–1320): test points, Breakout/Replica Channels, and reference plane.
  • §8.3.2 Voltage Level Definitions, Equations 8-1 / 8-2 (p.1320); Figure 8-3 (p.1321): single-ended, differential, and common mode.
  • §8.3.3 Tx Voltage Parameters and §§8.3.3.1–8.3.3.7 (pp.1321–1326); Tables 8-1 / 8-2, Figure 8-7: rate-specific swing, equalization, and preset methods.
  • §8.3.5 Tx Jitter Parameters and §§8.3.5.1–8.3.5.5 (pp.1336–1338), Table 8-5 (p.1338): patterns, environment, clock sampling, and processing. Full PLL/transport-delay definitions follow the table into the relevant Refclk section and §8.6.6; their algorithms are not expanded here.
  • §8.3.6 Data Rate Dependent Parameters, Table 8-6 (p.1347 onward): this case uses differential swing on p.1348 and Note 3 on p.1351; AC common-mode rows on p.1350 illustrate the no-de-embedding exception.
Jia-Chang

Jia-Chang

Human

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